SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can inhibit bonding failure of a bump.SOLUTION: A semiconductor device manufacturing method comprises the steps of: forming a first bump electrode on a first surface of a first semiconductor chip; forming second bump electrodes and projections on a second surface of a second semiconductor chip; fixing the first and second semiconductor chips by using the projections so as to oppose the first surface and the second surface; performing reflow on the first semiconductor chip and the second semiconductor chip to electrically connect the first semiconductor chip and the second semiconductor chip; and subsequently curing the projections at a temperature lower than a reflow temperature.