| 发明名称 |
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF |
| 摘要 |
An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and exposed from a surface of the encapsulant. Since the antenna body is not disposed on the substrate, the surface area of the substrate can be reduced to meet the miniaturization requirement of the electronic package. |
| 申请公布号 |
US2015145747(A1) |
申请公布日期 |
2015.05.28 |
| 申请号 |
US201414146163 |
申请日期 |
2014.01.02 |
| 申请人 |
Siliconware Precision Industries Co., Ltd |
发明人 |
Chung Hsin-Lung;Fang Hao-Ju;Chiu Chih-Hsien;Chu Yude;Tsai Tsung-Hsien |
| 分类号 |
H01Q1/40;H05K13/00 |
主分类号 |
H01Q1/40 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic package, comprising:
a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate wherein, a surface of the antenna body is exposed from a surface of the encapsulant. |
| 地址 |
Taichung TW |
