LIGHT-EMITTING MODULE AND LAMP USING SAME

摘要

A light-emitting module 1 includes a substrate 110, an LED chip 120 arranged on a main surface of the substrate 110, a sealing member 140 covering the LED chip 120 on the main surface of the substrate 110 and converting a wavelength of the light produced by the LED chip 120, and a heat transfer member 160 thermally connecting the sides of the LED chip 120 to the main surface of the substrate 110 and dissipating heat produced by the LED chip 120 to the substrate 110. The heat transfer member 160 is made up of a silicone resin having particles 161 dispersed therein, the particles being nanoparticles of ZrO 2 and microparticles 161 of MgO, which have higher thermal conductivity than the silicone resin.