| 摘要 |
PROBLEM TO BE SOLVED: To improve mounting reliability of a capacitance substrate in connecting the capacitance substrate and a package. ! SOLUTION: A capacitance substrate 1 according to one embodiment comprises: an insulating substrate 11; a first electrode layer 12 provided on an upper surface of the insulating substrate 11; a second electrode layer 13 provided on a lower surface of the insulating substrate 11 and arranged so as to face the first electrode layer 12; and an electrode 14 for bonding provided on a lower surface of the second electrode layer 13. A lower surface of the electrode layer 14 for bonding is divided into a plurality of bonding regions in an island-like shape, and a coating layer 15 is provided in each of the peripheries of the bonding regions. ! COPYRIGHT: (C)2015,JPO&INPIT |
