| 摘要 |
The present invention aims to uniformly supply a resin material to the inside of a cavity without reducing productivity. The present invention relates a method for providing a granulized resin material (R) with uniform thickness to a frame (31) having an upper opening and a lower opening in the shapes corresponding to openings of a lower mold cavity and to a recessed containing part (33) formed by a release film (32) coating the lower opening of the frame (31). The method includes: an arrangement process of arranging the recessed containing part (33) to locate one divided area (33A), among a plurality of planar areas obtained by dividing the recessed containing part (33), under a resin supplying hole (35a) of a linear feeder (35) arranged on a right location; a resin supplying process of supplying the granulized resin (R) in uniform thickness to the divided area (33A) by moving the recessed containing part (33) with respect to the resin supplying hole (35a) while the granulized resin (R) is supplied from the resin supplying hole (35a); and an area moving process of moving the recessed containing part (33) to locate another diving area (33B), different from the dividing area (33A), under the resin supplying hole (35a). |
