SUBSTRATE PROCESING SYSTEM, SUBTRATE HOLDER, SUBSTRATE HOLDER PAIR, SUBSTRATE, BONDING APPARATUS, AND DEVICE MANUFACTURING METHOD

摘要

Provided is a substrate processing system that can restrict flow of dust to regions where semiconductor substrates are mounted, when semiconductor substrates are layered using a pair of substrate holders. The substrate processing system includes a substrate holder system that causes a first substrate holder holding a first substrate and a second substrate holder holding a second substrate to face each other and sandwiches the first substrate and the second substrate, and a processing apparatus that holds the substrate holder system. At least one of the substrate holder system and the processing apparatus includes a dust flow inhibiting mechanism that inhibits flow of dust into a region sandwiching the first substrate and the second substrate.