| 摘要 |
PROBLEM TO BE SOLVED: To provide a component incorporated wiring board of which the reliability is improved, by preventing reduction of an adhesion strength between a core substrate and a wiring lamination part.SOLUTION: A component incorporated wiring board 10 includes a core substrate 11, components 100 and 101, a resin filler 93 and a wiring lamination part 32. The components 100 and 101 are accommodated in a plurality of accommodation hole parts 90 and 91, respectively, while turning a core principal surface 12 and a component principal surface 102 to the same side. The resin filler 93 fills a gap between an inner wall surface 92 and a component side surface 104 of the accommodation hole parts 90 and 91. The core substrate 11 includes a bridge part 61 which is positioned between the neighboring accommodation hole parts 90 and 91, and an outer peripheral part 62 in which a rear-side conductor layer 81 is formed. The bridge part 61 is made thinner than total thickness of the outer peripheral part 62 and the rear-side conductor layer 81, and a gap between a front side of the bridge part 61 and the wiring lamination part 32 is filled with a part of the resin filler 93. |
