ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide an electronic component mounting method and an electronic component mounting system capable of precisely mounting electronic components at high density.SOLUTION: The electronic component mounting system includes a screen printing unit and a solder application unit. The screen printing unit has a mask plate 22 in which plural pattern holes 22a with a relatively large area formed corresponding to plural first lands 5A in the plural lands formed in the substrate 4. The screen printing unit performs screen-printing with solder PA on the plural lands 5A using the mask plate 22. The solder application unit separately applies solder PB to each of plural second lands 5B other than the first lands 5A using a dispenser 37. An electronic component mounting unit mounts electronic components 6 on the substrate 4 supplied with the solder.