| 发明名称 | Manufacturing methods of semiconductor substrate, package and device | ||
| 摘要 | A manufacturing method of semiconductor substrate includes following steps: providing a base layer; forming a plurality of traces on the base layer; forming a plurality of studs correspondingly on the traces; forming a molding material layer on the base layer to encapsulate the traces and studs; forming a concave portion on the molding material layer; and, removing the base layer. | ||
| 申请公布号 | US9059050(B2) | 申请公布日期 | 2015.06.16 |
| 申请号 | US201414159474 | 申请日期 | 2014.01.21 |
| 申请人 | ADVANPACK SOLUTIONS PTE. LTD. | 发明人 | Lim Shoa-Siong;Lim Kian-Hock |
| 分类号 | H01L21/302;H01L23/13;H01L23/498;H01L25/10;H01L21/48;H01L21/56;H01L23/24;H01L23/31 | 主分类号 | H01L21/302 |
| 代理机构 | McClure, Qualey & Rodack, LLP | 代理人 | McClure, Qualey & Rodack, LLP |
| 主权项 | 1. A manufacturing method of semiconductor substrate, package or device, comprising: providing a base layer; forming a first conductive layer on the base layer; forming a second conductive layer on the first conductive layer; forming a molding material layer on the base layer to encapsulate the first and second conductive layers; thinning the molding material layer to form a carrier having a first surface and a second surface opposite the first surface, wherein the first and second conductive layers are embedded in the carrier and electrically connecting the first surface to the second surface; forming a concave portion on the carrier; and removing the base layer. | ||
| 地址 | Kallang SG | ||