SYSTEM IN A PACKAGE (SiP)

摘要

A system in a package (SiP) includes a first semiconductor die having a nonvolatile memory and trim/repair circuitry, and a second semiconductor die having a volatile memory and trim/repair circuitry. The first and the second semiconductor die are in a same package. The nonvolatile memory of the first semiconductor die is configured to store trim/repair values for each of the first and the second semiconductor die. The trim/repair circuitries of the first and second semiconductor die are configured to, in response to a reset of the second semiconductor die, copy the trim/repair values from the nonvolatile memory of the first semiconductor die to the volatile memory of the second semiconductor die.

主权项

1. A system in a package (SiP), comprising:
a first semiconductor die having a nonvolatile memory and trim/repair circuitry; and a second semiconductor die having a volatile memory and trim/repair circuitry, wherein the first and the second semiconductor die are in a same package, wherein the nonvolatile memory of the first semiconductor die is configured to store trim/repair values for each of the first and the second semiconductor die, and wherein, trim/repair circuitries of the first and second semiconductor die are configured to, in response to a reset of the second semiconductor die, copy the trim/repair values from the nonvolatile memory of the first semiconductor die to the volatile memory of the second semiconductor die.