发明名称 COMPOSITE STRUCTURE PACKAGING MATERIAL AND MOLDED ARTICLE USING SAME AND PRODUCTION METHOD AND COATING LIQUID THEREFOR
摘要 aaSiMMaSiMPPThe disclosed composite structure includes a base material (X) and a layer (Y). The layer (Y) includes a mixture of a metal oxide (A) a phosphorus compound (B) and a compound (L) (silicon compound). A compound containing a site capable of reacting with the metal oxide (A) is included in the phosphorus compound (B) and compound (L) examples. The equation 0.01?N/N?0.30 is satisfied when the number of moles of a metal atom (M) derived from the metal oxide (A) is N and the number of moles of a Si atom derived from the compound (L) is N. In addition the equation 0.8?N/N?4.5 is satisfied when the number of moles of a phosphorus atom derived from the phosphorus compound (B) is N.
申请公布号 IN3173CHN2014(A) 申请公布日期 2015.07.03
申请号 IN2014CHENP3173 申请日期 2014.04.25
申请人 KURARAY CO. LTD. 发明人 SASAKI RYOICHI;YOSHIDA KENTARO;OMODA MAMORU;HIROSE WATARU;SHIBATA MANABU;OSHITA TATSUYA
分类号 B32B9/00;B65D65/40;C09D7/12 主分类号 B32B9/00
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