DICING FILM AND DICING DIE-BONDING FILM

摘要

The present invention relates to a dicing film which comprises a base film and an adhesive layer, wherein the storage elastic modulus of the adhesive layer is 3x10^5 to 4x10^6 Pa at 30°C. The cross-linking density of the adhesive layer is 80-99%; to a dicing film; to a dicing die bonding film including the dicing film; and to a method for dicing a semiconductor wafer using the dicing die bonding film.