STUD BUMP AND PACKAGE STRUCTURE THEREOF AND METHOD OF MANUFACTURING THE SAME

摘要

Provided are a stud bump, a package structure thereof, and a method for manufacturing the same. The stud bump structure includes a first chip and a silver alloy stud bump arranged on a substrate. The on-chip silver alloy stud bump includes 0.01~10 wt% Pd and the rest is silver. The package structure additionally includes a substrate-upper part bonding pad electrically connected to the on-chip silver alloy stud bump by flip chip bonding.