Edge coupling of semiconductor dies

摘要

Edge coupling of semiconductor dies. In some embodiments, a semiconductor device may include a first semiconductor die, a second semiconductor die disposed in a face-to-face configuration with respect to the first semiconductor die, and an interposer arranged between the first semiconductor and second semiconductor dies, the interposer having an edge detent configured to allow an electrical coupling between the first and second semiconductor dies. In other embodiments, a method may include coupling a first semiconductor die to a surface of an interposer where an edge of the interposer includes detents and the first semiconductor die includes a first pad aligned with a first detent, coupling a second semiconductor die to an opposite surface of the interposer where the first and second semiconductor dies are in a face-to-face configuration and the second semiconductor die includes a second pad aligned with a second detent, and coupling the first and second pads together.

主权项

1. A semiconductor device, comprising:
a first semiconductor die; a second semiconductor die disposed in a face-to-face configuration with respect to the first semiconductor die; and an interposer sandwiched between a first adhesive layer disposed on a bottom surface of the first semiconductor die and a second adhesive layer disposed on a top surface of the second semiconductor die, wherein the interposer has having an edge detent located at an outermost perimeter of the interposer, wherein the first adhesive layer is separated from a first pad on the bottom surface of the first semiconductor die by a first passivation component, wherein the second adhesive layer is separated from a second pad on the bottom surface of the second semiconductor die by a second passivation component, and wherein the edge detent is configured to receive a solder ball to allow an electrical coupling between corresponding electrical terminals on the first and second semiconductor dies without the use of bondwires between the corresponding electrical terminals.