PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, SEMICONDUCTOR DEVICE, AND METHOD FOR FORMING RESIST PATTERN

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that solves problems of the prior arts and allows formation of a resist pattern having excellent adhesiveness to a metal layer and sufficient resolution and heat resistance even when a coating film having a thickness of more than 20 μm is formed.SOLUTION: The photosensitive resin composition comprises components of: (A) a resin having a phenolic hydroxyl group; (B) at least one compound selected from a group consisting of a compound having two or more oxirane rings, a compound having a methylol group, and a compound having an alkoxyalkyl group; (C) a photosensitive acid generator; and (D) a compound having a siloxane bond.