| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board which improves connectivity, and to provide a multilayer wiring board employing the same.SOLUTION: A wiring board 5 includes: a plurality of laminated insulation layers 1; and a thin film multilayer part 4 including through conductors 3 provided in the insulation layers 1 and wiring layers 2 provided between the plurality of insulation layers 1 and electrically connected to the through conductors 3. In at least one layer gap among layer gaps of the plurality of insulation layers 1 in the thin film multilayer part 4, the wiring layer 2 and the through conductor 3 are electrically connected via a junction member 7 disposed therebetween, and the insulation layers 1 are adhered via a resin adhesion layer 8 disposed therebetween. The junction member 7 includes a main body part 7a and a protruding part 7b. The protruding part 7b protrudes from the main body part 7a in a layer direction of the insulation layer 1 closer to the junction with the wiring layer 2. The resin adhesion layer 8 is disposed between the protruding part 7b and the insulation layer 1.</p> |
