发明名称 RADIO FREQUENCY IDENTIFICATION OVERLAY NETWORK FOR FIBER OPTIC COMMUNICATION SYSTEMS
摘要 In this invention, a radio frequency identification overlay network that automates the discovery and configuration management of all physical fiber optic connections within a distributed communications network is disclosed. Miniaturized, low crosstalk RFID tags at a first fiber optic receptacle location and miniature, distributed, multiplexed reader antenna at a distant, second fiber optic receptacle location are joined by a fiber optic link which transmits both optical data and RF electronic signals. This electronic-fiber optic interface is comprised of two separated, miniaturized resonant antenna in communication with another through a resonant RF transmission line integral to the fiber optic cable. This RFID overlay network is comprised of multiplexed RFID readers, RF resonant fiber optic cables, and miniaturized RFID tags attached to the connector receptacles of network elements. The RFID overlay network interrogates tags automatically and remotely through the RF transmissive and optically transmissive fiber optic patch cords.
申请公布号 US2015222352(A1) 申请公布日期 2015.08.06
申请号 US201314047169 申请日期 2013.10.07
申请人 Kewitsch Anthony Stephen 发明人 Kewitsch Anthony Stephen
分类号 H04B10/07;G06K19/077 主分类号 H04B10/07
代理机构 代理人
主权项 1. A miniaturized, multi-layer, three-dimensional stacked RFID tag device for attachment to a fiber optic connector receptacle to provide selective response to a localized RF signal at a particular frequency that has been launched on an electrically resonant fiber optic transmission line interconnecting proximal and distal ends thereof, whereby with the fiber optic transmission line being coupled to a fiber optic connector receptacle at its proximal end to transmit the electronic identification signal produced by the RFID tag device to an RFID reader circuit at its distal end, wherein the multilayer stacked tag device comprises: a first layer including a ferrite core inductor with a thickness in the stack dimension of less than 5 mm and first and second peripheral terminals; a second layer of like maximum thickness in the stack dimension, including a capacitor, with third and fourth peripheral terminals; a third layer disposed in the stack between the first and second layers and including an RVID transceiver with fifth and sixth peripheral terminals, and a pair of conductive elements, one joining the peripheries of the first, third and fifth terminals to the first conductive element and the other joining the peripheries of the second, fourth and sixth terminals to the second conductive element.
地址 Marina del Rey CA US