HEAT CONDUCTIVE SHEET AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a heat conductive sheet capable of achieving a semiconductor device having high insulation reliability, and provide the semiconductor device having high insulation reliability.SOLUTION: A heat conductive sheet according to the present invention contains a thermosetting resin (A) and an inorganic filler (B) dispersed in the thermosetting resin (A). The heat conductive sheet conforms to JIS K6911, and a specific volume resistance of a hardener of the heat conductive sheet at 175°C that is measured at 1 min after impressing an 1000 V of electric voltage, is equal to or more than 1.0×10&OHgr;m.