VERTICALLY INTEGRATED SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide an integrated circuit system.SOLUTION: An integrated circuit system includes: a first active layer formed on a front surface of a semiconductor die; and a second preformed layer on a rear surface of the semiconductor die. The second preformed layer has an electric component embedded therein, and the electric component includes at least one individual passive component. Further, the integrated system includes at least one electric path bonding the first active layer with the second preformed layer.