ADHESIVE COMPOSITION, ADHESIVE SHEET, AND ELECTRONIC DEVICE

摘要

The present invention is: an adhesive composition that contains a polyisobutylene resin (A) and a curable resin (B), said adhesive composition being characterized in that when the loss tangent (tanδ) of an adhesive layer formed from said composition is δ1 at 150 °C and δ2 at 70 °C, (δ1/ δ2) is 2.4 or less; and an electronic device that is formed by being sealed by an adhesive sheet. The present invention provides: an adhesive composition having excellent moisture barrier properties and adhesive strength, and excellent holding power; an adhesive sheet having an adhesive layer formed from said adhesive composition; and an electronic device formed by being sealed by said adhesive sheet.