PRINTED WIRING BOARD, MANUFACTURING METHOD OF THE SAME, AND PACKAGE-ON-PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a printed wiring board which improves the connection reliability between a printed wiring board and an upper substrate mounted on the printed wiring board.SOLUTION: Since a diameter d1 of a metal post 77 is smaller than a diameter d2 of a second opening 71FP of a solder resist layer 70F, the metal post 77 does not contact with the solder resist layer 70F and is not subject to heat stress of the solder resist layer 70F. Thus, the connection reliability of the metal post 77 is high.