| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electroplating bath and an electroplating method, in which upon forming a cobalt or cobalt alloy plating film, a resist layer applied on a conductor is easily inhibited from peeling and adhesiveness between a plating film and the conductor is easily and reliably obtained.SOLUTION: The electroplating bath contains a water-soluble cobalt salt and a conductive salt that enhances conductivity of the electroplating bath. The electroplating bath satisfies, for example, such a condition that the total content of potassium ions and sodium ions is 5 g/L or less. The electroplating bath contains an organic acid that has an acid dissociation constant pKa of 7 or less and has a carboxyl group; and the electroplating bath has a pH lower than the acid dissociation constant pKa of 7 or less of the organic acid. The electroplating method is carried out by energizing the electroplating bath using a conductor as a cathode, which has a layered portion where a resist layer comprising an organic polymer as a base material is layered. Thus, a cobalt or cobalt alloy plating film is formed in an exposed portion where an outer surface of the conductor is exposed.</p> |
