| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a mold releasing film for semiconductor device manufacturing, a manufacturing method of a mold releasing film for semiconductor device manufacturing and a manufacturing method of a resin encapsulated semiconductor device using the mold releasing film, which can easily release a resin encapsulated semiconductor device from a mold and which does not make a hole at the time of resin encapsulation molding and which can mold a resin encapsulated semiconductor device at low cost.SOLUTION: A manufacturing method of a resin encapsulated semiconductor device comprises: a step of providing a semiconductor device including a semiconductor element; a step of providing a mold having a recess on a surface; a step of fixing a mold releasing film which has a cushion layer including polyamide resin and a pealing layer provided at least one surface of the cushion layer, to the mold so as to follow at least the recess; a step of supplying encapsulation resin or an encapsulation resin precursor to on the mold releasing film including the inside of the recess; a step of arranging the semiconductor device and the mold so as to soak the semiconductor element in the encapsulation resin or the encapsulation resin precursor; and a step of hardening the encapsulation resin or the encapsulation resin precursor in a state of soaking the semiconductor element in the encapsulation resin or the encapsulation resin precursor.</p> |
