发明名称 |
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
<p>A printed circuit board according to an embodiment of the present invention includes: an inner insulating layer; an upper insulating layer formed on the inner insulating layer; and a lower insulating layer formed below the inner insulating layer. The inner insulating layer includes a first insulating layer made of a glass film including pure glass.</p> |
申请公布号 |
KR20150103974(A) |
申请公布日期 |
2015.09.14 |
申请号 |
KR20140025722 |
申请日期 |
2014.03.04 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
SHIN, HEUN GUN;KIM, JAE HWA |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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