发明名称 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 <p>A printed circuit board according to an embodiment of the present invention includes: an inner insulating layer; an upper insulating layer formed on the inner insulating layer; and a lower insulating layer formed below the inner insulating layer. The inner insulating layer includes a first insulating layer made of a glass film including pure glass.</p>
申请公布号 KR20150103974(A) 申请公布日期 2015.09.14
申请号 KR20140025722 申请日期 2014.03.04
申请人 LG INNOTEK CO., LTD. 发明人 SHIN, HEUN GUN;KIM, JAE HWA
分类号 H05K3/46 主分类号 H05K3/46
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