| 发明名称 | Acoustic wave device | ||
| 摘要 | An acoustic wave device includes: an acoustic wave filter chip that is mounted on a multilayered substrate including wiring layers; a first wiring that is electrically coupled to an internal circuit of the acoustic wave filter chip and formed in a first wiring layer of the multilayered substrate; a second wiring that is formed in a second wiring layer separate from the first wiring layer; and a via wiring that penetrates at least a part of the multilayered substrate and connects the first wiring to the second wiring; wherein the first wiring, the second wiring, and the via wiring forms a first inductor of which a direction of magnetic flux intersects with a stacking direction of the multilayered substrate. | ||
| 申请公布号 | US9148106(B2) | 申请公布日期 | 2015.09.29 |
| 申请号 | US201313907661 | 申请日期 | 2013.05.31 |
| 申请人 | TAIYO YUDEN CO., LTD. | 发明人 | Iwaki Masafumi |
| 分类号 | H03H9/25;H03H1/00;H03H9/05;H03H9/64 | 主分类号 | H03H9/25 |
| 代理机构 | Chen Yoshimura LLP | 代理人 | Chen Yoshimura LLP |
| 主权项 | 1. An acoustic wave device comprising: an acoustic wave filter chip that is mounted on a multilayered substrate including wiring layers; a first wiring that is electrically coupled to an internal circuit of the acoustic wave filter chip and formed in a first wiring layer of the multilayered substrate; a second wiring that is formed in a second wiring layer separate from the first wiring layer; and a via wiring that penetrates at least a part of the multilayered substrate and connects the first wiring to the second wiring; wherein the first wiring, the second wiring, and the via wiring forms a first inductor of which a direction of magnetic flux extends along a planar direction of a surface of the multilayered substrate. | ||
| 地址 | Tokyo JP | ||