| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a prepreg capable of increasing the latitude in circuit wiring patterns by enabling improvement in performance of a board, and to provide a circuit board and a semiconductor device which use the prepreg. <P>SOLUTION: In the prepreg formed by impregnating into a fibrous base material, a resin composition containing a cyanate resin and/or its prepolymer, and an inorganic filler, when setting mutually orthogonal X, Y directions on a surface of the prepreg, a thermal expansion coefficient [Ax] in the X direction of a cured product obtained by curing the prepreg at 30-150°C is≤10 ppm, and a thermal expansion coefficient [Ay] in the Y direction thereof at 30-150°C is≤10 ppm. The circuit board is composed of the cured product of the prepreg. In the semiconductor device, a semiconductor element is loaded on the circuit board. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
