| 摘要 |
<p>The object of the present invention is to provide a thermosetting resin composition which can provide a cured material which is excellent in heat resistance, electrical properties, and flexibility, and has storage stability before curing, and in order to achieve the object, the present invention provides a thermosetting resin composition containing a polyimide resin (C) which has a structure represented by the following general formula (1) and/or general formula (2), and an epoxy resin (B), wherein X represents a residue in which two phenolic hydroxyl groups are excluded from a phenol compound having two or more phenolic hydroxyl groups in the molecule.</p> |
