| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate for a power module which reduces the warpage occurring during joining and improves the reliability of the joining when metal layers, having different thicknesses, are laminated on both surfaces of a ceramic substrate. <P>SOLUTION: In a manufacturing method of a substrate 3 for a power module where metal layers 6, 7, having different thicknesses, are laminated on both surfaces of a ceramic substrate 2, both the metal layers 6, 7 are disposed on both the surfaces of the ceramic substrate 2 and heated and joined to the ceramic substrate 2. Then, the metal layers 6, 7 are cooled while being pressurized in the thickness direction to cause plastic deformation on the metal layers 6, 7. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
