Thermal interface devices

摘要

A thermal interface device (100) having a containment structure (102) and a thermal conductor (104) is provided. Further, the containment structure (102) includes at least one wall (106,107), where the containment structure (102) is configured to facilitate passage of heat. Furthermore, the thermal interface device includes a thermal conductor (104) disposed at least in a portion of the containment structure (102). Moreover, the thermal conductor is configured to reversibly switch between a solid state and a liquid state. Also, the thermal interface device (100) is a re-workable device.