发明名称 Semiconductor wafer, method for manufacturing light receiving sensor, and light receiving sensor
摘要 A semiconductor wafer includes a semiconductor substrate, an optical filter formed on or above the semiconductor substrate, and a light detection region formed in the semiconductor substrate, with the Poisson ratio VS, Young's modulus ES, the radius r, and the thickness b of the semiconductor substrate, stress à in the optical filter, and the thickness d of the optical filter satisfy a relationship 1.0×10 -3 ‰¥{3×r 2 ×d×(1-VS)×Ã}/(ES×b 2 ).
申请公布号 EP2924737(A1) 申请公布日期 2015.09.30
申请号 EP20150161046 申请日期 2015.03.26
申请人 SEIKO EPSON CORPORATION 发明人 UEMATSU, AKIRA;MATSUO, ATSUSHI
分类号 H01L27/146 主分类号 H01L27/146
代理机构 代理人
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