发明名称 CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
摘要 The present invention relates to a chip electronic component and a manufacturing method thereof and, more specifically, to a chip electronic component which can increase a height-to-width ratio of a coil while preventing the occurrence of a short circuit between coils to realize an internal coil structure having a high aspect ratio (AR), and to a manufacturing method thereof.
申请公布号 KR20150108518(A) 申请公布日期 2015.09.30
申请号 KR20140031377 申请日期 2014.03.18
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHA, HYE YEON;LEE, DONG HWAN;JUNG, JUNG HYUK;YOON, CHAN;BANG, HYE MIN;KIM, TAE YOUNG
分类号 H01F17/00;H01F27/28 主分类号 H01F17/00
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