发明名称 導電材料の接合体
摘要 A bonded body of electrically conductive materials including a bonding interface structure in which paired bonded members (10, 20) made respectively of electrically conductive materials are surface-bonded to each other. The bonding interface structure has at least: a diffusion bonding region in which the electrically conductive materials are mutually diffused; and a plastic flow bonding region which has a pressure bonded and recrystallized structure through plastic flow of the electrically conductive materials.
申请公布号 JP5786866(B2) 申请公布日期 2015.09.30
申请号 JP20120548740 申请日期 2011.12.05
申请人 日産自動車株式会社 发明人 中川 成幸;南部 俊和;山本 千花;深見 徹
分类号 B23K20/00 主分类号 B23K20/00
代理机构 代理人
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