发明名称 基板処理装置および基板処理方法
摘要 <p><P>PROBLEM TO BE SOLVED: To reduce variations of the film thickness in each position of a substrate where droplets collide and improve the process quality of the substrate. <P>SOLUTION: Droplets of a process liquid are respectively injected from multiple injection ports 28 to multiple injection positions on an upper surface of the substrate. Concurrently with the injection of the process liquid, a protection liquid is discharged from multiple discharge ports 35 to multiple liquid adhering positions on the upper surface of the substrate. The protection liquid discharged from the multiple discharge ports 35 form multiple liquid films. The multiple liquid films respectively cover the different injection positions. The droplets of the process liquid are injected to the injection positions covered by the liquid films of the protection liquid. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5785462(B2) 申请公布日期 2015.09.30
申请号 JP20110187687 申请日期 2011.08.30
申请人 发明人
分类号 H01L21/304;B08B3/02 主分类号 H01L21/304
代理机构 代理人
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