Light emitting device package

摘要

A light emitting device package is disclosed. The light emitting device package includes a substrate (10) having through holes (12, 13); a seed metal (40) disposed inside the through holes (12, 13) and on an upper surface and a lower surface of the substrate (10); and an electrode (50) disposed inside the through holes (12, 13) and on the upper surface and a lower surface of the substrate (10), the electrode (50) including a diffusion barrier layer between an adhesion layer of Ti or Cr and an electrode gold layer, the diffusion barrier layer preventing the electrode gold layer from being degraded in electrical characteristics.