| 发明名称 |
SEMICONDUCTOR DEVICE HAVING BONDING PAD |
| 摘要 |
PURPOSE:To prevent cracking of a protective film by securing a linear connection on the uppermost surface of the convex junction pad and coating the side surface of the pad with a protective film. |
| 申请公布号 |
JPS5399765(A) |
申请公布日期 |
1978.08.31 |
| 申请号 |
JP19770012994 |
申请日期 |
1977.02.10 |
| 申请人 |
HITACHI LTD |
发明人 |
YOSHIMI TAKEO;SAKAI HIDEO |
| 分类号 |
H01L21/60;H01L21/31;H01L29/40;H01L29/41 |
主分类号 |
H01L21/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
