| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To thin a component incorporating wiring board in which components are embedded and mounted in an insulating plate. <P>SOLUTION: The component incorporating wiring board includes: a first insulation layer 11; a second insulation layer 12 positioned in the shape of being laminated on the first insulation layer; a passive element component 41 embedded in the second insulation layer and provided with a plurality of terminals; a wiring pattern held between the first insulation layer and the second insulation layer and including a connection land for the passive element component; and a connection member 51 for electrically connecting the plurality of terminals of the passive element component and the connection land of the wiring pattern. The passive element component includes a planar inorganic material substrate and a passive element formed in a layer shape on one surface of the inorganic material substrate. A lead part of the passive element is formed by a copper pattern, and a film of an organic insulation material is provided in contact with at least a part of the passive element on one surface of the inorganic material substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
