| 摘要 |
The objective of the present invention is to provide a semiconductor adhesive capable of minimizing voids. The present invention is a semiconductor adhesive used in a method for manufacturing a semiconductor device having: a step (1) for aligning on a substrate a semiconductor chip in which a protruding electrode having a tip section comprising solder is formed in a peripheral portion and farther inward of the peripheral portion in the plane of the semiconductor chip, with the semiconductor adhesive being interposed therebetween; a step (2) for heating the semiconductor chip to a temperature at or above the melting point of the solder to fusion-bond the protruding electrode of the semiconductor chip and an electrode section of the substrate, and to temporarily bond the semiconductor adhesive; and a step (3) for heating the semiconductor adhesive in a pressurized environment to eliminate voids, wherein the semiconductor adhesive has a minimum melt viscosity of 1000 Pa・s or less at 80-200°C, and the time required to reach a reaction rate of 40% at 260°C is 8 seconds or more as determined using the Ozawa method. |
