| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a component-built-in wiring board having a highly reliable component-built-in structure. <P>SOLUTION: The component-built-in wiring board comprises: a planar insulation layer containing an inorganic material filler having a determined constant nominal particle size; a wiring pattern formed as a layer that coincides with a planar spread direction of the planer insulation layer; a component including a terminal, the component being embedded in the thickness of the planar insulation layer in close contact therewith such that either one of the terminal faces the surface of the wiring pattern; and a connection member formed so as to electrically, and mechanically connect one surface of the component and the surface of the wiring pattern, with melting point increasing solder having phase parts of plural element systems between a seed of high melting point metal particles, and a high melting point metal and tin that cover the seed. The connection member is formed, having such a thickness that the clearance between the component and the wiring pattern is less than the nominal particle diameter of the inorganic material filler of the planar insulation layer, in such a shape that the connection member does not spread out of between one surface of the terminal of the component and the surface of the wiring pattern. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
