| 摘要 |
There is provided a substrate inspection apparatus in which a contact between a probe (16) and a semiconductor device (28) is checked without using an IC tester. Further, when an abnormal state is detected in the contact check, a cause of the abnormal state can be determined. A prober (10) includes a probe card (15) having a plurality of probes (16) to be contacted with respective electrode pads (37) of the semiconductor device (28) formed on a wafer W. The probe card (15) includes a card-side inspection circuit (18) configured to reproduce a circuit configuration of DRAM in which the semiconductor device (28) cut from the wafer W is to be mounted, and a comparator (34) configured to measure a potential of a line (19) between the probe (16) and the card-side inspection circuit (18). |
