Semiconductor device with face-to-face chips on interposer and method of manufacturing the same

摘要

A method of making a semiconductor device with face-to-face chips on interposer includes the step of attaching a chip-on-interposer subassembly on a heat spreader with the chip inserted into a cavity of the heat spreader so that the heat spreader provides mechanical support for the interposer. The heat spreader also provides thermal dissipation, electromagnetic shielding and moisture barrier for the enclosed chip. In the method, a second chip is also electrically coupled to a second surface of the interposer and an optional second heat spreader is attached to the second chip.

主权项

1. A method of making a semiconductor device with face-to-face chips on interposer, comprising the steps of:
providing an interposer that includes a first surface, a second surface opposite to the first surface, first contact pads on the first surface, second contact pads on the second surface, and through vias that electrically couple the first contact pads and the second contact pads; electrically coupling a first chip to the first contact pads of the interposer by a plurality of bumps to provide a chip-on-interposer subassembly; providing a first heat spreader having a cavity; attaching the chip-on-interposer subassembly to the first heat spreader using a thermally conductive material with the first chip inserted into the cavity and the interposer laterally extending beyond the cavity; and with the chip-on-interposer subassembly attached to the first heat spreader, electrically coupling a second chip to the second contact pads of the interposer by a plurality of bumps, wherein the step of electrically coupling the first chip to the first contact pads of the interposer is performed on a panel scale, and a singulation step is executed to separate individual chip-on-interposer subassemblies before the step of attaching the chip-on-interposer subassembly to the first heat spreader.