Semiconductor device, and on-board power conversion device

摘要

Provided is a semiconductor device capable of improving heat-radiating performance of a heating element. The semiconductor device of the present invention includes: a heating element (1); a heat-radiating member (2) including an element contact portion (2a) which is held surface contact with a mounting surface (1e); a first pressing member (3) and a second pressing member (4) held in contact with the heating element (1); and a fixation screw (6) for fixing the first pressing member (3) to the heat-radiating member (2) through a through hole (3c) formed through the first pressing member (3). The first pressing member (3) and the second pressing member (4) each include an inclined surface formed so that a component force of an axial force of a tightening force of the fixation screw (6) is generated in a vertical direction with respect to the mounting surface (1e).

主权项

1. A semiconductor device, comprising:
a heating element including terminals extending in a vertical direction with respect to a mounting board, the heating element being connected to the mounting board through the terminals; a heat-radiating member including an element contact portion which is held in direct or indirect surface contact with a mounting surface of the heating element; pressing means held in contact with the heating element, for pressing the heating element against the heat-radiating member; and fastening means for fixing the pressing means to the heat-radiating member through a through hole formed through the pressing means in parallel to the mounting surface, wherein the pressing means includes an inclined surface formed so that a component force of an axial force of a tightening force of the fastening means is generated in a vertical direction with respect to the mounting surface, wherein h heating element includes a resin-molded package, and the pressing means is held in direct contact with the resin-molded package of the heating element.