发明名称 Method and system for measuring bumps based on phase and amplitude information
摘要 A method and device for measuring a height of a microscopic structure such as solder bumps. For simplicity of explanation, the invention is described with respect to phase information and amplitude information wherein phase detection and calculation algorithms are being used.
申请公布号 US9147102(B2) 申请公布日期 2015.09.29
申请号 US201213342119 申请日期 2012.01.02
申请人 CAMTEK LTD. 发明人 Koren Shimon;Shur Or;Malinovich Yacov;Golan Gilad
分类号 G06K9/32;G06K9/00;G02B21/00;G01N21/956;G01B11/06 主分类号 G06K9/32
代理机构 Reches Patents 代理人 Reches Patents
主权项 1. A device for measuring a height of a microscopic structure, the device comprises: a storage circuit arranged to store information that comprises amplitude information and phase information, wherein the stored information is indicative of a shape and a size of the microscopic structure; a mask generation circuit arranged to threshold pixels of the amplitude information to provide a mask that comprises masked amplitude pixels that have amplitude values above an amplitude threshold; a phase information circuit arranged to apply the mask on the phase information to provide masked phase pixels; select, out of the masked phase pixels, selected phase pixels that form a part of the masked phase pixels and correspond to a phase criterion, the selected phase pixels have selected phase pixels attribute values; find, out of the phase information, elected phase pixels that have the selected phase pixel attribute values; and a height calculation circuit arranged to generate a height measurement result based the elected phase pixels.
地址 Migdal Haemek IL