| 发明名称 |
MOLDING A FLUID FLOW STRUCTURE |
| 摘要 |
In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board. |
| 申请公布号 |
SG11201506770X(A) |
申请公布日期 |
2015.09.29 |
| 申请号 |
SGX11201506770 |
申请日期 |
2013.03.20 |
| 申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
CHEN, CHIEN-HUA;CUMBIE, MICHAEL W.;AGARWAL, ARUN K. |
| 分类号 |
B41J2/16;B41J2/045 |
主分类号 |
B41J2/16 |
| 代理机构 |
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代理人 |
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| 主权项 |
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