| 摘要 |
This method is a production method for semiconductor devices obtained by sealing semiconductor elements by using a sealing sheet. The production method for semiconductor devices comprises: a preparation step in which a sealing sheet and a plurality of semiconductor elements are prepared; a sealing step in which, after the preparation step, the plurality of semiconductor elements are sealed as a batch, by using the sealing sheet; and a recovery step in which, after the sealing step, the sealing sheet and the plurality of semiconductor elements are recovered. |
