Interconnect for battery packs

摘要

Provided are interconnect circuits for interconnecting arrays of battery cells and methods of forming these interconnect circuits as well as connecting these circuits to the battery cells. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different battery cell terminal. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.

主权项

1. A method of forming an interconnect circuit for interconnecting an array of battery cells, the method comprising:
forming a set of conductive layer openings in a conductive layer,
wherein the conductive layer openings in the set are separated from each other by two or more connecting tabs,wherein the set of the conductive layer openings and the two or more connecting tabs surround and define a region of the conductive layer, andwherein, after forming the set of the conductive layer openings, the two or more connecting tabs mechanically support and maintain registration of the region of the conductive layer relative to other portions of the conductive layer; laminating the conductive layer comprising the set of the conductive layer openings to a support layer,
wherein, after laminating the conductive layer to the support layer, the support layer mechanically supports and maintains registration of the region of the conductive layer relative to the other portions of the conductive layer; and removing at least one of the two or more connecting tabs,
wherein removing the at least one of the two or more connecting tabs converts the set of the conductive layer openings into a continuous conductive layer channel at least partially surrounding and defining the region of the conductive layer.