发明名称 Charge-compensation semiconductor device
摘要 An active area of a semiconductor body includes a first charge-compensation structure having spaced apart n-type pillar regions, and an n-type first field-stop region of a semiconductor material in Ohmic contact with a drain metallization and the n-type pillar regions and having a doping charge per area higher than a breakdown charge per area of the semiconductor material. A punch-through area of the semiconductor body includes a p-type semiconductor region in Ohmic contact with a source metallization, a floating p-type body region and an n-type second field-stop region. The floating p-type body region extends into the active area. The second field-stop region is in Ohmic contact with the first field-stop region, forms a pn-junction with the floating p-type body region, is arranged between the p-type semiconductor region and floating p-type body region, and has a doping charge per area lower than the breakdown charge per area of the semiconductor material.
申请公布号 US9147763(B2) 申请公布日期 2015.09.29
申请号 US201314033941 申请日期 2013.09.23
申请人 Infineon Technologies Austria AG 发明人 Weber Hans;Hirler Franz;Willmeroth Armin;Gamerith Stefan
分类号 H01L29/66;H01L29/78 主分类号 H01L29/66
代理机构 Murphy, Bilak & Homiller, PLLC 代理人 Murphy, Bilak & Homiller, PLLC
主权项 1. A semiconductor device, comprising a semiconductor body comprising a main horizontal surface, an active area, a punch through area, a source metallization arranged on the main horizontal surface and a drain metallization, in the active area the semiconductor body further comprising in a vertical cross-section substantially orthogonal to the main horizontal surface: a first charge-compensation structure comprising a plurality of spaced apart first n-type pillar regions; and an n-type first field-stop region comprised of a semiconductor material, in Ohmic contact with the drain metallization and the first n-type pillar regions, and having a doping concentration per area higher than a breakdown charge per area of the semiconductor material divided by the elementary charge,in the punch-through area the semiconductor body further comprising: a p-type semiconductor region in Ohmic contact with the source metallization; a floating p-type body region extending from the punch-through area into the active area; and an n-type second field-stop region in Ohmic contact with the first field-stop region, forming a pn-junction with the floating p-type body region, arranged between the p-type semiconductor region and the floating p-type body region, and having a doping concentration per area lower than the breakdown charge per area of the semiconductor material divided by the elementary charge.
地址 Villach AT