发明名称 Negative photosensitive resin composition, partition walls for optical device and production process thereof, process for producing optical device having the partition walls, and ink repellent solution
摘要 To provide a negative photosensitive resin composition which is excellent in storage stability of silanol groups and which is applicable to preparation of partition walls which can maintain excellent ink repellency even after ink affinity-imparting treatment, and partition walls for an optical device using such a composition.;A negative photosensitive resin composition comprising an ink repellent (A) made of a fluorosiloxane compound having a hydroxy group bonded to a silicon atom and containing fluorine atoms in a proportion of from 10 to 55 mass % based on the total amount of the compound, a photosensitive resin (B) having an acidic group and an ethylenic double bond in one molecule, a photopolymerization initiator (C) and a solvent (D), wherein the proportion of the ink repellent (A) is from 0.01 to 10 mass % based on the total solid content of the composition, and the proportion of the hydroxy groups bonded to a silicon atom derived from the ink repellent (A) is from 0.000001 to 1.0 mmol/g based on the total amount of the composition.
申请公布号 US9146462(B2) 申请公布日期 2015.09.29
申请号 US201313914064 申请日期 2013.06.10
申请人 Asahi Glass Company, Limited 发明人 Ishizeki Kenji;Furukawa Yutaka
分类号 G03F7/075;G03F7/004;G02B5/20;G02B5/22;C08G65/00;C08L83/08;G03F7/00;G03F7/032;C08G77/16;C08G77/24;C08G65/336;H01L27/32 主分类号 G03F7/075
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A negative photosensitive resin composition comprising: an ink repellent (A) made of a fluorosiloxane compound comprising: a hydroxy group bonded to a silicon atom: and fluorine atoms in a proportion of from 10 to 55 mass % based on a total amount of the fluorosiloxane compound; a photosensitive resin (B) comprising an acidic group and an ethylenic double bond in one molecules; a photopolymerization initiator (C); and a solvent (D), wherein a proportion of the ink repellent (A) is from 0.01 to 10 mass % based on a total solid content of the negative photosensitive resin composition, and a proportion of the hydroxy groups bonded to a silicon atom derived from the ink repellent (A) is from 0.000001 to 1.0 mmol/g based on a total amount of the negative photosensitive resin composition.
地址 Chiyoda-ku JP