Linked vacuum processing tools and methods of using the same

摘要

In some embodiments, a linked processing tool system is provided that includes (1) a first processing tool having at least a first transfer chamber configured to couple to a plurality of processing chambers; (2) a second processing tool having at least a second transfer chamber configured to couple to a plurality of processing chambers; (3) a third transfer chamber coupled between the first and second processing tools and configured to transfer substrates between the first and second processing tools; and (4) a single sequencer that controls substrate transfer operations between the first processing tool, the second processing tool and the third transfer chamber of the linked processing tool system. Numerous other aspects are provided.

主权项

1. A linked processing tool system comprising:
a first processing tool having at least a first transfer chamber configured to couple to a plurality of processing chambers; a second processing tool having at least a second transfer chamber configured to couple to a plurality of processing chambers; a third transfer chamber coupled between the first and second processing tools and configured to transfer substrates between the first and second processing tools; a first via coupling the first transfer chamber of the first processing tool directly to the third transfer chamber; a second via coupling the second transfer chamber of the second processing tool directly to the third transfer chamber; a third via coupling the first transfer chamber of the first processing tool directly to the second transfer chamber of the second processing tool, the via bypassing the third transfer chamber; and a single sequencer that controls substrate transfer operations between the first processing tool, the second processing tool and the third transfer chamber of the linked processing tool system.