发明名称 Reactive contacts for 2D layered metal dichalcogenides
摘要 Techniques for forming metal contacts to LMDC-based devices are provided. In one aspect, a method of forming a metal contact to a LMDC semiconductor material includes the steps of: depositing a contact metal onto the LMDC semiconductor material; and annealing the LMDC semiconductor material and the contact metal under conditions sufficient to react the contact metal with the LMDC semiconductor material and thereby form a buffer layer as an interface between the contact metal and the LMDC semiconductor material that compositionally is a transition from the LMDC semiconductor material to the contact metal and connects the LMDC semiconductor material and the contact metal by covalent bonds. The LMDC semiconductor material can be a material having a formula MX2, wherein M is a metal, and X is a chalcogen. A LMDC-based device and techniques for forming the device are also provided.
申请公布号 US9147824(B1) 申请公布日期 2015.09.29
申请号 US201414272889 申请日期 2014.05.08
申请人 International Business Machines Corporation 发明人 Cao Qing;Han Shu-Jen
分类号 H01L21/44;H01L21/06;H01L39/24;H01L29/40;H01L49/02;H01L21/02 主分类号 H01L21/44
代理机构 Vazken Alexanian 代理人 Vazken Alexanian ;Chang, LLC Michael J.
主权项 1. A method of forming a metal contact to a two-dimensional layered metal dichalcogenides (LMDC) semiconductor material, the method comprising the steps of: depositing a contact metal onto the LMDC semiconductor material; and annealing the LMDC semiconductor material and the contact metal under conditions sufficient to react the contact metal with the LMDC semiconductor material and thereby form a buffer layer as an interface between the contact metal and the LMDC semiconductor material that compositionally is a transition from the LMDC semiconductor material to the contact metal and connects the LMDC semiconductor material and the contact metal by covalent bonds.
地址 Armonk NY US