Flip chip light emitting diode packaging structure

摘要

A flip chip light emitting diode packaging structure includes a substrate and an LED located on the substrate. The LED includes a P electrode and a N electrode. The substrate includes a first electrode and a second electrode mounted on a top surface of the substrate. The first electrode and the second electrode have a first protrusion and a second protrusion. The P electrode and the N electrode are fixed on the top surface of the first protrusion and the second protrusion through the solder. The bottom edge of the P electrode and the N electrode is beyond the top edge of the first protrusion and the second protrusion.

主权项

1. A flip chip light emitting diode (LED) packaging structure, comprising:
a substrate including a first electrode and a second electrode; an LED chip, wherein the LED chip having a P electrode and an N electrode; and wherein the first electrode and the second electrode extends through a top side of the substrate and a bottom side of the substrate, the first electrode further comprises a first protrusion located on the top surface of the substrate, the second electrode further comprises a second protrusion located on the top surface of the substrate; and wherein the P electrode includes a conductive plate, the P electrode and N electrode are fixed to the first protrusion and the second protrusion through a solder, a bottom edge of the conductive plate and the N electrode is beyond a top edge of the first protrusion and the second protrusion.